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LT1812IS5 Datasheet(PDF) 5 Page - Linear Technology |
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LT1812IS5 Datasheet(HTML) 5 Page - Linear Technology |
5 / 12 page 5 LT1812 SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Minimum Supply Voltage ±2V PSRR Power Supply Rejection Ratio VS = ±2V to ±5.5V 75 dB AVOL Large-Signal Voltage Gain VOUT = ±3V, RL = 500Ω 0.8 V/mV VOUT = ±3V, RL = 100Ω 0.6 V/mV VOUT Maximum Output Swing RL = 500Ω, 30mV Overdrive ±3.60 V RL = 100Ω, 30mV Overdrive ±3.15 V IOUT Maximum Output Current VOUT = ±3V, 30mV Overdrive ±30 mA ISC Output Short-Circuit Current VOUT = 0V, 1V Overdrive (Note 3) ±55 mA SR Slew Rate AV = – 1 (Note 5) 350 V/ µs GBW Gain Bandwidth Product f = 200kHz 60 MHz ISHDN SHDN Pin Current SHDN > V – + 2.0V (On) ±2 µA SHDN < V – + 0.4V (Off) – 200 µA IS Supply Current SHDN > V – + 2.0V (On) 5 mA SHDN < V – + 0.4V (Off) 200 µA ELECTRICAL CHARACTERISTICS Note 1: Absolute Maximum Ratings are those values beyond which the life of the device may be impaired. Note 2: Differential inputs of ±3V are appropriate for transient operation only, such as during slewing. Large sustained differential inputs can cause excessive power dissipation and may damage the part. Note 3: A heat sink may be required to keep the junction temperature below absolute maximum when the output is shorted indefinitely. Note 4: Input offset voltage is pulse tested and is exclusive of warm-up drift. Note 5: Slew rate is measured between ±2V on the output with ±3V input for ±5V supplies and 2VP-P on the output with a 3VP-P input for single 5V supplies. Note 6: Full power bandwidth is calculated from the slew rate: FPBW = SR/2 πVP. Note 7: This parameter is not 100% tested. Note 8: The LT1812C is guaranteed to meet specified performance from 0 °C to 70°C. The LT1812C is designed, characterized and expected to meet specified performance from – 40 °C to 85°C but is not tested or QA sampled at these temperatures. The LT1812I is guaranteed to meet specified performance from –40 °C to 85°C. Note 9: θJA is specified for a 2500mm2 board covered with 2 oz copper on both sides. Thermal resistance varies, depending upon the amount of PC board metal attached to the device. For this package in particular, power is dissipated primarily through Pin 4, which should therefore, have a good thermal connection to a copper plane. –40 °C ≤ TA ≤ 85°C. VS = ±5V, VCM = 0V unless otherwise noted (Note 8). –40 °C ≤ TA ≤ 85°C, VS = 5V, VCM = 2.5V, RL to 2.5V unless otherwise noted (Note 8). SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VOS Input Offset Voltage (Note 4) 3.5 mV ∆VOS/∆T Input Offset Voltage Drift (Note 7) 10 30 µV/°C IOS Input Offset Current 600 nA IB Input Bias Current ±6 µA VCM Input Voltage Range (Positive) 3.5 V Input Voltage Range (Negative) 1.5 V CMRR Common Mode Rejection Ratio VCM = 1.5V to 3.5V 70 dB AVOL Large-Signal Voltage Gain VOUT = 1.5V to 3.5V, RL = 500Ω 0.6 V/mV VOUT = 2.0V to 3.0V, RL = 100Ω 0.4 V/mV VOUT Maximum Output Swing (Positive) RL = 500Ω, 30mV Overdrive 3.7 V RL = 100Ω, 30mV Overdrive 3.5 V Maximum Output Swing (Negative) RL = 500Ω, 30mV Overdrive 1.3 V RL = 100Ω, 30mV Overdrive 1.5 V IOUT Maximum Output Current VOUT = 3.5V or 1.5V, 30mV Overdrive ±17 mA ISC Output Short-Circuit Current VOUT = 2.5V, 1V Overdrive (Note 3) ±40 mA SR Slew Rate AV = – 1 (Note 5) 125 V/ µs GBW Gain Bandwidth Product f = 200kHz 50 MHz ISHDN SHDN Pin Current SHDN > V – + 2.0V (On) ±2 µA SHDN < V – + 0.4V (Off) – 100 µA IS Supply Current SHDN > V – + 2.0V (On) 5 mA SHDN < V – + 0.4V (Off) 100 µA |
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