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RV0005F Datasheet(PDF) 1 Page - Solid States Devices, Inc |
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RV0005F Datasheet(HTML) 1 Page - Solid States Devices, Inc |
1 / 2 page NOTE: All specifications are subject to change without notification. SCD's for these devices should be reviewed by SSDI prior to release. DATA SHEET #: RV0005F DOC Solid State Devices, Inc. 14701 Firestone Blvd * La Mirada, Ca 90638 Phone: (562) 404-4474 * Fax: (562) 404-1773 ssdi@ssdi-power.com * www.ssdi-power.com Designer’s Data Sheet Part Number / Ordering Information 1/ SGB _ _ UF SMS __ L L L L Screening2/ = None TX = TX Level TXV = TXV Level S = S Level Package SMS = Surface Mount Square Tab Recovery Time UF = Ultra Fast Voltage 10 = 1000 V 15 = 1500 V 20 = 2000 V 25 = 2500 V 30 = 3000 V 35 = 3500 V SGB10UFSMS thru SGB35UFSMS 60 mAMP 1000-3500 VOLTS 60 nsec HIGH VOLTAGE RECTIFIER FEATURES: Ultra Fast Recovery: 60 nsec Maximum PIV to 3500 Volts Hermetically Sealed Void-Free Construction Metallurgically Bonded 175°C Maximum Operating Temperature Micro Miniature Package TX, TXV, and Space Level Screening Available 2/ ELECTRICAL CHARACTERISTICS Part Number Peak Inverse Voltage Average Rectified Current Maximum Reverse Current Maximum Forward Voltage Maximum Surge Current (1 Cycle) 9/ Maximum Reverse Recovery Time Maximum Junction Capacitance Typical Thermal Impedance Symbol PIV I0 IR@PIV VF4/ IFSM tRR7/ CJ JE Units Volts mA A Volts Amps nsec pF °C/W Conditions 25°C 100°C 25°C 100°C 25°C 25°C 25°C VR = 100V fT = 1MHZ SGB10UFSMS 1000 60 50 0.1 10 9.5 5 60 1.0 165 SGB15UFSMS 1500 60 50 0.1 10 9.5 5 60 1.0 165 SGB20UFSMS 2000 60 50 0.1 10 9.5 5 60 1.0 165 SGB25UFSMS 2500 60 50 0.1 10 9.5 5 60 1.0 165 SGB30UFSMS 3000 60 50 0.1 10 9.5 5 60 1.0 165 SGB35UFSMS 3500 60 50 0.1 10 9.5 5 60 1.0 165 1/ For Ordering Information, Price, and Availability – Contact Factory. 2/ Screening based on MIL-PRF-19500. Screening flows available on request. 3/ Operating and testing over 10,000 V/inch may require encapsulation or immersion in a suitable dielectric material. 4/ IF = IO; Max. forward voltage measured with instantaneous forward pulse of 300µsec minimum. 5/ Max. lead temperature for soldering is 250°C, 3/8” from case for 5 sec maximum. 6/ Operating and storage temperature: -65°C to +175°C. 7/ Reverse Recovery Test Conditions: IF=50mA, IR=100mA, IRR=25mA, TA=25°C. 8/ Consult manufacturing for operating curves. 9/ tP = 1 ms, square wave. Surface Mount Square Tab |
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