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UPD78P324LP Datasheet(PDF) 10 Page - NEC

Part # UPD78P324LP
Description  16-/8-Bit Single-Chip Microcomputers
Download  80 Pages
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Manufacturer  NEC [NEC]
Direct Link  http://www.nec.com/
Logo NEC - NEC

UPD78P324LP Datasheet(HTML) 10 Page - NEC

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µPD78P324, 78P324(A)
10
TABLE OF CONTENTS
1.
LIST OF PIN FUNCTIONS ...........................................................................................................
11
1.1
NORMAL OPERATION MODE ...........................................................................................................
11
1.2
PROM PROGRAMMING MODE (RESET = H, AVDD = L) .................................................................
13
1.3
PIN I/O CIRCUIT AND UNUSED-PIN PROCESSING .......................................................................
14
2.
DIFFERENCE BETWEEN
µPD78P324 AND µPD78324 .............................................................. 16
3.
PROM PROGRAMMING ..............................................................................................................
17
3.1
OPERATION MODE ............................................................................................................................
18
3.2
PROCEDURE FOR PROM WRITE ......................................................................................................
19
3.3
PROCEDURE FOR PROM READ ........................................................................................................
21
4.
ERASURE CHARACTERISTICS (
µPD78P324KC/KD ONLY) ..................................................... 22
5.
ERASURE WINDOW SEAL (
µPD78P324KC/KD ONLY) ........................................................... 22
6.
ONE-TIME PROM PRODUCT SCREENING ................................................................................
22
7.
ELECTRICAL SPECIFICATIONS ..................................................................................................
23
8.
PACKAGE DRAWINGS ................................................................................................................
65
9.
RECOMMENDED SOLDERING CONDITIONS ...........................................................................
69
APPENDIX A. CONVERSION SOCKET PACKAGE DRAWING AND
RECOMMENDED SUBSTRATE INSTALLATION PATTERN ..................................
71
APPENDIX B. TOOLS .........................................................................................................................
73
B.1
DEVELOPMENT TOOLS .....................................................................................................................
73
B.2
EVALUATION TOOLS ........................................................................................................................
77
B.3
EMBEDDED SOFTWARE ....................................................................................................................
77


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