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DMN24H11DS-7 Datasheet(PDF) 2 Page - Diodes Incorporated

Part # DMN24H11DS-7
Description  N-CHANNEL ENHANCEMENT MODE MOSFET
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

DMN24H11DS-7 Datasheet(HTML) 2 Page - Diodes Incorporated

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DMN24H11DS
Document number: DS37092 Rev. 3 - 2
2 of 6
www.diodes.com
April 2014
© Diodes Incorporated
DMN24H11DS
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Drain-Source Voltage
VDSS
240
V
Gate-Source Voltage
VGSS
±20
V
Continuous Drain Current (Note 6) VGS = 10V
Steady
State
TA = +25°C
TA = +70°C
ID
0.27
0.22
A
Pulsed Drain Current (10μs pulse, duty cycle
≦1%)
IDM
0.8
A
Maximum Body Diode Continuous Current (Note 5)
IS
0.8
A
Peak diode recovery dv/dt
dv/dt
6.0
V/ns
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Total Power Dissipation
(Note 5)
PD
0.75
W
(Note 6)
1.2
Thermal Resistance, Junction to Ambient
(Note 5)
RθJA
166
°C/W
(Note 6)
104
Thermal Resistance, Junction to Case
(Note 6)
RθJC
35
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BVDSS
240
V
VGS = 0V, ID = 250µA
Zero Gate Voltage Drain Current
IDSS
100
nA
VDS = 240V, VGS = 0V
Gate-Body Leakage
IGSS
±100
nA
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
VGS(th)
1.0
2.0
3.0
V
VDS = VGS, ID = 250µA
Static Drain-Source On-Resistance
RDS (ON)
3.7
11
VGS = 10V, ID = 0.3A

4.0
12
VGS = 4.5V, ID = 0.2A
Diode Forward Voltage
VSD
0.7
1.2
V
VGS = 0V, IS = 0.1A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Ciss
76.8
pF
VDS = 25V, VGS = 0V,
f = 1.0MHz
Output Capacitance
Coss
6.9
Reverse Transfer Capacitance
Crss
4.1
Gate Resistance
RG

17

VDS = 0V, VGS = 0V, f = 1.0MHz
Total Gate Charge
Qg
3.7
nC
VDS = 192V, VGS = 10V,
ID = 0.1A
Gate-Source Charge
Qgs
0.3
Gate-Drain Charge
Qgd
2.1
Turn-On Delay Time
tD(on)
4.8
nS
VDS = 120V, ID = 0.1A,
VGS = 10V, RG = 6.0Ω
Turn-On Rise Time
tr
4.7
Turn-Off Delay Time
tD(off)

17.5

Turn-Off Fall Time
tf

102.3

Reverse Recovery Time
trr

45.6

nS
VR = 100V, IF = 1.0A,
di/dt = 100A/µs
Reverse Recovery Charge
Qrr

51.6

nC
Notes:
5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper pad layout
7 .Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.


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