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UPG131G Datasheet(PDF) 6 Page - NEC |
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UPG131G Datasheet(HTML) 6 Page - NEC |
6 / 8 page 6 µµµµPG139GV RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. Soldering process Soldering Conditions Symbol Infrared Ray Reflow Peak package’s surface temperature: 235°C or below Reflow time: 30 seconds or less (at 210°C) Number of reflow process: 3, Exposure limit Note: None IR35-00-3 VPS Peak package’s surface temperature: 215°C or below Reflow time: 40 seconds or less (at 200°C) Number of reflow process: 3, Exposure limit Note: None VP15-00-3 Wave Soldering Solder temperature: 260°C or below Flow time: 10 seconds or less Number of flow process: 1, Exposure limit Note: None WS60-00-1 Partial Heating Method Terminal temperature: 300°C Flow time: 3 seconds or less (per one pin), Exposure limit Note: None Note Exposure limit before soldering after dry-pack package is opened. Storage conditions: 25°C and relative humidity at 65% or less. Caution Do not apply more than a single process at once, except for “partial heating method”. |
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