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BDXXFA1FP3 Datasheet(PDF) 8 Page - Rohm

Part # BDXXFA1FP3
Description  High accuracy output voltage
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Manufacturer  ROHM [Rohm]
Direct Link  http://www.rohm.com
Logo ROHM - Rohm

BDXXFA1FP3 Datasheet(HTML) 8 Page - Rohm

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BDxxFA1FP3
Datasheet
TSZ02201-0GAG0A600600-1-2
© 2015 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
08.Jun.2015 Rev.003
Power Dissipation
SOT89-3K
0
0.5
1
1.5
2
0
255075
100
125
150
周囲温度: Ta [℃ ]
1.67W
θj‐a = 74.8℃/W
Ambient Tempearture : Ta [°C]
Measurement condition: mounted on 4-layer JEDEC standard board
Board size: 114.3mm × 76.2mm × 1.6mm
When considering thermal design, operation should be maintained within the following conditions.
(The temperature mentioned below is a guaranteed temperature, therefore, margins must be considered.)
1. Ambient temperature Ta is 85°C and below.
2. Junction temperature Tj is 150°C and below.
The junction temperature Tj can be determined as follows:
Calculation based on ambient temperature Ta
Tj=Ta+θj-a×W
<Reference Value>
・θ
j-a: SOT89-3K 74.8°C/W
JEDEC standard 4 layers PCB
Board size: 114.3mm × 76.2mm × 1.6mm
Most of the heat loss that occurs in BDxxFA1FP3 is generated from the output Pch FET. Power loss is determined by the
product of voltage drop across Vcc-Vo and the output current. Check the conditions of output voltage and output current to be
used between Vcc-Vo and compare with the power dissipation characteristics.
In addition, power dissipation may change significantly due to board conditions because BDxxFA1FP3 uses power package. It is
important to consider the board size to be used before proceeding with the design.
Power consumption [W] = { Input voltage (Vcc) – Output voltage (Vo) } × Output current (Io: Ave)


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