RFCM3050

40-1003MHZ GAAS/GAN

POWER DOUBLER MODULE

trademarks are the properly of their respective owners. ©2009, RF Micro Devices, Inc.

DS130621

7628 Thorndike Road, Greensboro, NC 27409-9421 – For sales or technical

Support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com

4 of 6

Application Circuit

Evaluation Board Layout

Note:

The ground plane of the RFCM3050 module should be soldered onto a board equipped with as many thermal vias as possible. Underneath this

thermal via array a heat sink with thermal grease needs to be placed which is able to dissipate the complete module DC power (up to 10.6 Watts).

In any case the module backside temperature should not exceed 100°C.

C8

4.7nF

R5

C6

1.2pF

C3

1.2pF

R4

10

Ω

C2

4.7nF

C10

DNI

D2

MM3Z5V6T1

R1

10k

Ω

D1

TGL34-33A

C1

4.7nF

C7

4.7nF

U1

RFCM3050

1

2

3

4

9

8

7

6

5

FB1

Bead 60

Ω

T3

RFXF0007

T1

RFXF0010

T2

RFXF0008

V+

GND

RF IN

RF OUT

C9

DNI

C12

DNI

C11

0.5pF

C14

DNI

C13

DNI

D3

TQP200001

R7

0

Ω

R8

0

Ω

R9

0

Ω

Capacity by Bondpads

R10

0

Ω

R11

0

Ω

R12

0

Ω

Capacity by Bondpads