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RFFM4200SQ Datasheet(PDF) 4 Page - RF Micro Devices |
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RFFM4200SQ Datasheet(HTML) 4 Page - RF Micro Devices |
4 / 15 page 4 of 15 RFFM4200 DS121008 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or customerservice@rfmd.com. Pin Function Description 1GND Ground connection. 2GND Ground connection. 3 VCC3 This pin is connected internally to the collector of the 3rd stage RF device. To achieve specified perfor- mance, the layout of these pins should match the Recommended Land Pattern. 4 VCC2 This pin is connected internally to the collector of the 3rd stage RF device. To achieve specified perfor- mance, the layout of these pins should match the Recommended Land Pattern. 5GND Ground connection. 6 VCC1 This pin is connected internally to the collector of the 3rd stage RF device. To achieve specified perfor- mance, the layout of these pins should match the Recommended Land Pattern. 7VBIAS Supply voltage for the bias reference and control circuits. 8GND Ground connection. 9GND Ground connection. 10 TXIN RF input is internally matched to 50 and DC blocked. 11 GND Ground connection. 12 PDOWN Power down pin. Apply <0.6VDC to power down the three power amplifier stages. Apply 1.75VDC to 5.0VDC to power up. If function is not desired, Pin may be connected to VREG. 13 VREG1 First stage bias voltage. This Pin requires regulated supply for best performance. 14 VREG2 Second stage bias voltage. This Pin requires regulated supply for best performance. 15 VREG3 Third stage bias voltage. This Pin requires regulated supply for best performance. 16 PDET Power detector provides an output voltage proportional to the RF output power level. 17 GND Ground connection. 18 RX RF Output is internally matched to 50 and DC blocked. 19 VRX Switch control for RX mode. 20 GND Ground connection. 21 ANT RF Output is internally matched to 50 and DC blocked. 22 GND Ground connection. 23 GND Ground connection. 24 VTX Switch control for TX mode. PkG Base GND Ground connection. The back side of the package should be connected to the ground plane through as short a connection as possible, e.g., PCB vias under the device are recommended. |
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