ZXMN3B01F

SEMICO NDUC TORS

ISSUE 1 - DECEMBER 2005

2

PARAMETER

SYMBOL

VALUE

UNIT

Junction to Ambient

(a)

200

°C/W

Junction to Ambient

(b)

155

°C/W

NOTES

(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.

(b) For a device surface mounted on FR4 PCB measured at t

5 sec.

(c) Repetitive rating - 25mm x 25mm FR4 PCB, D=0.02, pulse width 300 s - pulse width limited by maximum junction temperature.

THERMAL RESISTANCE

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-Source Voltage

30

V

Gate-Source Voltage

12

V

Continuous Drain Current @V

(b)

(b)

(a)

2.0

1.6

1.7

A

A

A

Pulsed Drain Current

(c)

9.4

A

Continuous Source Current (Body Diode)

(b)

1.3

A

Pulsed Source Current (Body Diode)

(c)

9.4

A

(a)

Linear Derating Factor

625

5

mW

mW/°C

(b)

Linear Derating Factor

806

6.4

mW

mW/°C

Operating and Storage Temperature Range

-55 to +150

°C

ABSOLUTE MAXIMUM RATINGS