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IRF6723M2DTR1PBF Datasheet(PDF) 3 Page - International Rectifier |
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IRF6723M2DTR1PBF Datasheet(HTML) 3 Page - International Rectifier |
3 / 10 page IRF6723M2DTR/TR1PbF www.irf.com 3 Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient Surface mounted on 1 in. square Cu board, steady state. TC measured with thermocouple incontact with top (Drain) of part. Used double sided cooling, mounting pad with large heatsink. Notes: Mounted on minimum footprint full size board with metalized back and with small clip heatsink. Rθ is measured at TJ of approximately 90°C. Surface mounted on 1 in. square Cu board (still air). Mounted on minimum footprint full size board with metalized back and with small clip heatsink. (still air) 1E-006 1E-005 0.0001 0.001 0.01 0.1 1 10 t1 , Rectangular Pulse Duration (sec) 0.001 0.01 0.1 1 10 100 0.20 0.10 D = 0.50 0.02 0.01 0.05 SINGLE PULSE ( THERMAL RESPONSE ) Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthja + Tc Ri (°C/W) τi (sec) 3.1440 0.000878 23.201 0.291662 19.855 1.970485 9.7220 0.027200 τ J τJ τ1 τ 1 τ 2 τ2 τ3 τ 3 R 1 R 1 R 2 R 2 R 3 R 3 Ci= τi/Ri Ci= τi/Ri τ A τA τ 4 τ4 R 4 R 4 Absolute Maximum Ratings (each die operating consecutively) Parameter Units PD @TA = 25°C Power Dissipation e W PD @TA = 70°C Power Dissipation e PD @TC = 25°C Power Dissipation f TP Peak Soldering Temperature °C TJ Operating Junction and TSTG Storage Temperature Range Thermal Resistance (each die operating consecutively) Parameter Typ. Max. Units RθJA Junction-to-Ambient el ––– 56 RθJA Junction-to-Ambient jl 12.5 ––– RθJA Junction-to-Ambient kl 20 ––– °C/W RθJC Junction-to-Case fl ––– 5.9 RθJ-PCB Junction-to-PCB Mounted 1.0 ––– Linear Derating Factor eà W/°C 0.018 270 -55 to + 175 Max. 25 2.7 1.9 |
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