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SGC2363ZPCK2 Datasheet(PDF) 4 Page - RF Micro Devices |
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SGC2363ZPCK2 Datasheet(HTML) 4 Page - RF Micro Devices |
4 / 6 page 4 of 6 DS111011 7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com. SGC2363Z SOT-363 PCB Pad Layout Package Drawing Dimensions in inches (millimeters) Refer to drawing posted at www.rfmd.com for tolerances. Pin Function Description 3RF IN RF input pin. This pin requires the use of an external DC blocking capacitor chosen for the frequency of operation. 1, 2, 4, 5 GND Connection to ground. Use via holes as close to the device ground as possible to reduce ground inductance and achieve optimum RF performance. 6RF OUT/DC BIAS RF output and bias pin. This pin requires the use of an external DC blocking capacitor chosen for the frequency of opera- tion. Dimensions in inches [millimeters] RF OUT RF I N Notes: 1. Provide a large ground pad area under device pins 1, 2, 4, and 5 with several plated-through holes placed as shown. 2. 1-2 ounce finished copper thickness is recommended. 3. RF I/O lines are 50 Ω |
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Similar Description - SGC2363ZPCK2 |
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