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BFU550 Datasheet(PDF) 2 Page - NXP Semiconductors

Part # BFU550
Description  NPN wideband silicon RF transistor
Download  22 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BFU550 Datasheet(HTML) 2 Page - NXP Semiconductors

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BFU550
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
Rev. 1 — 5 March 2014
2 of 22
NXP Semiconductors
BFU550
NPN wideband silicon RF transistor
[1]
Tsp is the temperature at the solder point of the collector lead.
[2]
If K > 1 then Gp(max) is the maximum power gain. If K  1 then Gp(max) =MSG.
2.
Pinning information
3.
Ordering information
[1]
The customer evaluation kit contains the following:
a) Unpopulated RF amplifier Printed-Circuit Board (PCB)
b) Unpopulated RF amplifier Printed-Circuit Board (PCB) with emitter degeneration
c) Four SMA connectors for fitting unpopulated Printed-Circuit Board (PCB)
d) BFU520, BFU530 and BFU550 samples
e) USB stick with data sheets, application notes, models, S-parameter and noise files
4.
Marking
Gp(max)
maximum power gain
IC =15 mA; VCE = 8 V; f = 900 MHz
[2] -21
-
dB
NFmin
minimum noise figure
IC =1 mA; VCE = 8 V; f = 900 MHz; S = opt
-0.7
-
dB
PL(1dB)
output power at 1 dB gain
compression
IC =25 mA; VCE =8V; ZS =ZL =50 ;
f=900MHz
-
13.5
-
dBm
Table 1.
Quick reference data …continued
Tamb =25 C unless otherwise specified
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Table 2.
Discrete pinning
Pin
Description
Simplified outline
Graphic symbol
1
collector
2base
3emitter
4emitter
Table 3.
Ordering information
Type number
Package
Name
Description
Version
BFU550
-
plastic surface-mounted package; 4 leads
SOT143B
OM7962
-
Customer evaluation kit for BFU520, BFU530 and BFU550 [1]
-
Table 4.
Marking
Type number
Marking
Description
BFU550
*TC
* = t : made in Malaysia
* = w : made in China


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