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BFU610F Datasheet(PDF) 3 Page - NXP Semiconductors |
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BFU610F Datasheet(HTML) 3 Page - NXP Semiconductors |
3 / 12 page BFU610F All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 2 — 11 January 2011 3 of 12 NXP Semiconductors BFU610F NPN wideband silicon RF transistor 4. Marking 5. Limiting values [1] Tsp is the temperature at the solder point of the emitter lead. 6. Thermal characteristics Table 4. Marking Type number Marking Description BFU610F D1* * = p : made in Hong Kong * = t : made in Malaysia * = w : made in China Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - 16 V VCEO collector-emitter voltage open base - 5.5 V VEBO emitter-base voltage open collector - 2.5 V IC collector current - 10 mA Ptot total power dissipation Tsp ≤ 90 °C [1] - 136 mW Tstg storage temperature −65 +150 °C Tj junction temperature - 150 °C Table 6. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-sp) thermal resistance from junction to solder point 440 K/W Fig 1. Power derating curve Tsp (°C) 0 160 120 40 80 001aam802 100 50 150 200 Ptot (mW) 0 |
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