BUJ302AD

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Product data sheet

Rev. 01 — 28 March 2011

10 of 14

NXP Semiconductors

BUJ302AD

NPN power transistor

8.

Soldering

Fig 16. Reflow soldering footprint for SOT428 (DPAK)

SOT428

6.15

5.80

5.90

1.80

7.00

1.30

1.50

1.40

1.65

4.57

6.00

6.125

4.725

6.50

0.30

1.00

1.15

5.65

2.30

2.40

2.45

3.60

6.00

5.75

4.60

solder lands

solder resist

occupied area

solder paste