MUN2213, MMUN2213L, MUN5213, DTC144EE, DTC144EM3, NSBC144EF3

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7

PACKAGE DIMENSIONS

SC−59

CASE 318D−04

ISSUE H

STYLE 1:

PIN 1. BASE

2. EMITTER

3. COLLECTOR

e

A1

b

A

E

D

2

3

1

C

L

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

2.4

0.094

0.95

0.037

0.95

0.037

1.0

0.039

0.8

0.031

mm

inches

SCALE 10:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIM

A

MIN

NOM

MAX

MIN

MILLIMETERS

1.00

1.15

1.30

0.039

INCHES

A1

0.01

0.06

0.10

0.001

b

0.35

0.43

0.50

0.014

c

0.09

0.14

0.18

0.003

D

2.70

2.90

3.10

0.106

E

1.30

1.50

1.70

0.051

e

1.70

1.90

2.10

0.067

L

0.20

0.40

0.60

0.008

2.50

2.80

3.00

0.099

0.045

0.051

0.002

0.004

0.017

0.020

0.005

0.007

0.114

0.122

0.059

0.067

0.075

0.083

0.016

0.024

0.110

0.118

NOM

MAX