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PBSS5240X Datasheet(PDF) 3 Page - NXP Semiconductors

Part # PBSS5240X
Description  40 V, 2 A PNP low VCEsat (BISS) transistor
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PBSS5240X Datasheet(HTML) 3 Page - NXP Semiconductors

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NXP Semiconductors
PBSS5240X
40 V, 2 A PNP low VCEsat (BISS) transistor
PBSS5240X
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved
Product data sheet
19 October 2012
3 / 12
Symbol
Parameter
Conditions
Min
Max
Unit
[3]
-
1.35
W
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
-65
150
°C
Tstg
storage temperature
-65
150
°C
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
Tamb (°C)
-75
175
125
25
75
-25
006aac675
0.5
1.0
1.5
Ptot
(W)
0.0
(1)
(2)
(3)
(1) FR4 PCB, mounting pad for collector 6 cm2
(2) FR4 PCB, mounting pad for collector 1 cm2
(3) FR4 PCB, standard footprint
Fig. 1. Power derating curves
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[1]
-
-
250
K/W
[2]
-
-
132
K/W
Rth(j-a)
thermal resistance
from junction to
ambient
in free air
[3]
-
-
93
K/W
Rth(j-sp)
thermal resistance
from junction to solder
point
-
-
16
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.


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