2002 Feb 28

3

NXP Semiconductors

Product data sheet

PBSS5240Y

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

Notes

1.

Device mounted on a printed-circuit board, single side copper, tinplated and standard footprint.

2.

THERMAL CHARACTERISTICS

Notes

1.

Device mounted on a printed-circuit board, single side copper, tinplated and standard footprint.

2.

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

collector-base voltage

open emitter

−

−40

V

collector-emitter voltage

open base

−

−40

V

emitter-base voltage

open collector

−

−5

V

collector current (DC)

−

−2

A

peak collector current

−

−3

A

peak base current

−

−300

mA

total power dissipation

−

270

mW

−

430

mW

storage temperature

−65

+150

°C

junction temperature

−

150

°C

operating ambient temperature

−65

+150

°C

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

thermal resistance from junction to

ambient

note 1

463

K/W

note 2

291

K/W