PBSS8110Y_2

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 02 — 21 November 2009

3 of 13

NXP Semiconductors

PBSS8110Y

[1]

Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, standard footprint.

[2]

pad.

[3]

pad.

6.

Thermal characteristics

[1]

Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated, standard footprint.

[2]

pad.

[3]

pad.

junction temperature

-

150

°C

operating ambient

temperature

−65

+150

°C

storage temperature

+150

°C

(2) Standard footprint

Fig 1.

Power derating curves

Table 5.

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

0

160

120

40

80

001aaa796

200

400

600

(mW)

0

(1)

(2)

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Typ

Unit

thermal resistance from junction

to ambient

in free air

[1] 431

K/W

[2] 260

K/W

[3] 200

K/W

thermal resistance from junction

to soldering point

in free air

[1] 85

K/W