NCP121

www.onsemi.com

8

PACKAGE DIMENSIONS

XDFN6 1.20x1.20, 0.40P

CASE 711AT

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.25mm FROM TERMINAL TIPS.

4. COPLANARITY APPLIES TO THE PAD AS

WELL AS THE TERMINALS.

A

SEATING

PLANE

0.05 C

A

A1

2X

2X

0.05 C

DIM

A

MIN

MAX

MILLIMETERS

0.30

0.45

A1

0.00

0.05

b

0.13

0.23

D

E

e

L

PIN ONE

REFERENCE

0.05 C

0.05 C

NOTE 3

L

e

b

3

6

6X

1

4

MOUNTING FOOTPRINT*

0.15

0.25

BOTTOM VIEW

E2

DIMENSIONS: MILLIMETERS

0.35

6X

0.24

6X

1.40

0.40

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

E2

0.20

0.40

TOP VIEW

B

SIDE VIEW

NOTE 4

RECOMMENDED

C

6X

A

M

0.10

B

C

PACKAGE

OUTLINE

D2

0.84

1.04

L1

1.20 BSC

1.20 BSC

0.40 BSC

0.05 REF

D2

1.08

0.40

D

E

DETAIL B

DETAIL A

DETAIL A

OPTIONAL

CONSTRUCTION

L

DETAIL B

MOLD CMPD

EXPOSED Cu

OPTIONAL

CONSTRUCTION

1

L1

6X

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