NCP170

www.onsemi.com

2

PIN FUNCTION DESCRIPTION

Pin No.

XDFN4

Pin No.

SOT−563

Pin Name

Description

4

1

IN

Power Supply Input Voltage

2

2

GND

Power Supply Ground

3

6

EN

Chip Enable Pin (Active “H”)

1

3

OUT

Output Pin

EPAD

EPAD

Internally Connected to GND

4

NC

No Connect

5

GND

Power Supply Ground

ABSOLUTE MAXIMUM RATINGS

Symbol

Rating

Value

Unit

Input Voltage (Note 1)

6.0

V

Output Voltage

V

Chip Enable Input

−0.3 to 6.0

V

Maximum Junction Temperature

150

°C

Storage Temperature

−55 to 150

°C

ESD Capability, Human Body Model (Note 2)

2000

V

ESD Capability, Machine Model (Note 2)

200

V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.

2. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per AEC-Q100-002 (EIA/JESD22-A114)

ESD Machine Model tested per AEC-Q100-003 (EIA/JESD22-A115)

Latchup Current Maximum Rating tested per JEDEC standard: JESD78

THERMAL CHARACTERISTICS

Symbol

Rating

Value

Unit

Thermal Characteristics, Thermal Resistance, Junction-to-Air

XDFN4 1

× 1mm

SOT−563

250

200

°C/W

Figure 2. Simplified Block Diagram