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NCP176AMX120TCG Datasheet(PDF) 10 Page - ON Semiconductor

Part # NCP176AMX120TCG
Description  Fast Transient Response Low Voltage 500 mA LDO
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCP176AMX120TCG Datasheet(HTML) 10 Page - ON Semiconductor

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10
The power dissipated by the LDO for given application
conditions can be calculated by the next equation:
P
D + VIN @ IGND ) VIN * VOUT @ IOUT [W]
(eq. 2)
Where IGND is the LDO’s ground current, dependent on
the output load current.
Connecting the exposed pad and
N/C pin to a large ground
planes helps to dissipate the heat from the chip.
The relation of
θJA and PD(MAX) to PCB copper area and
Cu layer thickness could be seen on the Figure 30.
Reverse Current
The PMOS pass transistor has an inherent body diode
which will be forward biased in the case when VOUT > VIN.
Due to this fact in cases, where the extended reverse current
condition can be anticipated the device may require
additional external protection.
Power Supply Rejection Ratio
The LDO features very high power supply rejection ratio.
The PSRR at higher frequencies (in the range above
100 kHz) can be tuned by the selection of COUT capacitor
and proper PCB layout. A simple LC filter could be added
to the LDO’s IN pin for further PSRR improvement.
Enable Turn−On Time
The enable turn−on time is defined as the time from EN
assertion to the point in which VOUT will reach 98% of its
nominal value. This time is dependent on various
application conditions such as VOUT−NOM, COUT and TA.
PCB Layout Recommendations
To obtain good transient performance and good regulation
characteristics place CIN and COUT capacitors as close as
possible to the device pins and make the PCB traces wide.
In order to minimize the solution size, use 0402 or 0201
capacitors size with appropriate effective capacitance.
Larger copper area connected to the pins will also improve
the device thermal resistance. The actual power dissipation
can be calculated from the equation above (Power
Dissipation section). Exposed pad and N/C pin should be
tied to the ground plane for good power dissipation.
ORDERING INFORMATION TABLE
Part Number
Voltage Option
Marking
Option
Package
Shipping
NCP176AMX100TCG
1.0 V
AA
With output discharge
XDFN6
(Pb−Free)
3000 / Tape & Reel
NCP176AMX120TCG
1.2 V
AE
NCP176AMX180TCG
1.8 V
AF
NCP176AMX300TCG
3.0 V
AC
NCP176AMX330TCG
3.3 V
AD
NCP176BMX100TCG
1.0 V
DA
Without output discharge
NCP176BMX120TCG
1.2 V
DE
NCP176BMX180TCG
1.8 V
DF
NCP176BMX300TCG
3.0 V
DC
NCP176BMX330TCG
3.3 V
DD
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.


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