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TDA8954 Datasheet(PDF) 10 Page - NXP Semiconductors |
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TDA8954 Datasheet(HTML) 10 Page - NXP Semiconductors |
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10 / 46 page  TDA8954_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 24 December 2009 10 of 46 NXP Semiconductors TDA8954 2 × 210 W class-D power amplifier Thermal foldback is active when: Tact(th_fold) < Tj < Tact(th_prot) The value of Tact(th_fold) for the TDA8954 is approximately 145 °C; see Table 9 for more details. The gain will be reduced by at least 6 dB (to Thg(th_fold)) before the temperature reaches Tact(th_prot) (see Figure 8). TFB can be disabled by applying the appropriate voltage on pin MODE (see Table 9), in which case the dissipation will not be limited by TFB. The junction temperature may then rise as high as the OTP threshold, when the amplifier will be shut down (see Section 8.4.1.2). The amplifier will start up again once it has cooled down. This introduces audio holes. The TFB warning signal is not disabled when the TFB is disabled via the MODE pin. This allows a temperature control function in the application to monitor the junction temperature and, if necessary, to reduce the level of the audio signal transmitted to the amplifier. 8.4.1.2 OverTemperature Protection (OTP) If TFB fails to stabilize the temperature and the junction temperature continues to rise, the amplifier will shut down as soon as the temperature reaches the thermal protection activation threshold, Tact(th_prot). The amplifier will resume switching approximately 100 ms after the temperature drops below Tact(th_prot). The thermal behavior is illustrated in Figure 8. Fig 7. TFB and TFB warning 010aaa561 VLOAD VDIAG1 T Tact(warn)th_fold Tact(th_fold) Thermal foldback activated t |
Similar Part No. - TDA8954_15 |
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Similar Description - TDA8954_15 |
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