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NCP691MN18T2G Datasheet(PDF) 5 Page - ON Semiconductor |
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NCP691MN18T2G Datasheet(HTML) 5 Page - ON Semiconductor |
5 / 15 page NCP690, NCP691, NCP692, NCV8690 http://onsemi.com 5 Table 3. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (Note 1) VIN −0.3 to 6.5 V Chip Enable Voltage VEN −0.3 to 6.5 V Output Voltage VOUT −0.3 to 6.5 V Output Voltage / Sense Input, (SNS pin) VSNS −0.3 to 6.5 V Electrostatic Discharge Human Body Model ESD 4000 V Machine Model 200 Maximum Junction Temperature TJ_MAX 150 _C Storage Temperature Range TSTG −65 to 150 _C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. NOTE: This device series contains ESD protection and exceeds the following tests: ESD HBM tested per JEDEC standard: JESD22−A114 ESD MM tested per JEDEC standard: JESD22−A115 Latch–up Current Maximum Rating: ≤ 150 mA per JEDEC standard: JESD78 Table 4. PACKAGE THERMAL CHARACTERISTICS Rating Condition Symbol Value Unit Thermal Resistance, Junction−to−Ambient (Note 2) DFN6 3x3, 1 oz Cu 64 mm2 Cu 645 mm2 Cu RqJA 169 70 °C/W DFN6 3x3, 2 oz Cu 64 mm2 Cu 645 mm2 Cu RqJA 151 62 °C/W Thermal Resistance, Junction−to−Pin RqJL 15 °C/W Table 5. OPERATING RANGES Rating Symbol Value Unit Operating Input Voltage (Notes 3 and 4) VIN 1.5 to 6.0 V Operating Junction Temperature Range TJ −40 to 125 °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. Minimum VIN = (VOUT + VDO) or 1.5 V, whichever is higher. 2. Soldered on FR4 copper area, please refer to Applications Section for Safe Operating Area. 3. Minimum VIN = (VOUT + VDO) or 1.5 V, whichever is higher. 4. Refer to Electrical Characteristics and Application Information for Safe Operating Area. |
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