BAS56

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Product data sheet

Rev. 3 — 29 June 2010

8 of 12

NXP Semiconductors

BAS56

High-speed double diode

11. Soldering

Fig 9.

Reflow soldering footprint BAS56 (SOT143B)

Fig 10. Wave soldering footprint BAS56 (SOT143B)

solder lands

solder resist

occupied area

solder paste

sot143b_fr

0.9

0.6

0.7

3.25

3

0.6

(3

×)

0.6

(3

×)

0.5

(3

×)

0.7

(3

×)

1

1.9

2

0.75

0.95

Dimensions in mm

solder lands

solder resist

occupied area

preferred transport direction during soldering

sot143b_fw

4.6

4.45

1.2

(3

×)

1.425

(3

×)

1.425

1

1.2

2.2

2.575

Dimensions in mm