NICHIA STS-DA1-3093B <Cat.No.150401>

5

SOLDERING

• Recommended Hand Soldering Condition

Temperature

380°C Max

Soldering Time

5sec Max

* Hand soldering must not be performed more than once.

* Since the silicone used in the encapsulating resin frame is soft, do not press on the encapsulating resin frame or resin area.

Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability.

* Repairing should not be done after the LEDs have been soldered.

It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.

* When soldering, do not apply stress to the LED while the LED is hot.

* When using a pick and place machine, choose an appropriate nozzle for this product. Using a pick-and-place nozzle

with a smaller diameter than the size of the LED's emitting surface will cause damage to the emitting surface

and may also cause the LED not to illuminate.

* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner

where the flux will come in contact with the LEDs.

* During and/or after soldering an electric wire to the electrode, ensure that tension is not applied to the electric wire.

This may cause the electrode to be damaged and/or reduce the adhesive strength of the electrode to the package.

* If soldering is used to join electric wires to the electrodes, the adhesive strength of the electrode to the package

may be reduced depending on the substances that are found in the solder paste and/or the type of the wire cover that is used.

Ensure that there are no issues with the materials that will be used in the chosen application prior to use.