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LD1611 Datasheet(PDF) 9 Page - LDT Co., Ltd |
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LD1611 Datasheet(HTML) 9 Page - LDT Co., Ltd |
9 / 13 page Ver1.1 9 LDT Inc. WE bldg. 5F, 126-33 Han-dle 1ro, Seobuk-gu, Cheonan, Chungnam, korea, 331-220 Tel. +82 41 520 7300 Fax. +82 41 520 7337 www.ldt.co.kr LD1611 High Power LED Driver 11.4 Layout Considerations For high frequency and high current switching power supplies, layout is an important design step. To reduce switching losses, the switch rise and fall times are made as short as possible. Minimize the length and area of all traces connected to the switch and always use a ground plane under the switching regulator to inter-plane coupling. The loop including LEDs, the PFM switch and schottky diode contains high current rising and falling and should be kept as short as possible. The input capacitor needs not only to be close to the VIN pin, but also to the GND pin in order to reduce the supply ripple. 11.5 Thermal Considerations The maximum IC junction temperature should be restricted to 125℃ under normal operating conditions. Calculate the maximum allowable dissipation, P D,MAX, and keep the actual dissipation less than or equal to P D,MAX. P D,MAX = (125℃ – TA) / R JA where, T A : maximum ambient temperature, R JA : thermal resistance junction to ambient |
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