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74ALVC_ALVCH16245 Datasheet(PDF) 2 Page - NXP Semiconductors

Part # 74ALVC_ALVCH16245
Description  16-bit transceiver with direction pin; 3-state
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

74ALVC_ALVCH16245 Datasheet(HTML) 2 Page - NXP Semiconductors

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9397 750 13117
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 03 — 12 May 2004
2 of 17
Philips Semiconductors
74ALVC16245; 74ALVCH16245
16-bit bus transceiver with direction pin; 3-state
3.
Quick reference data
[1]
CPD is used to determine the dynamic power dissipation (PD in µW).
PD = CPD × VCC2 × fi × N+ ∑ (CL × VCC2 × fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in Volts;
N = total load switching outputs;
∑ (C
L × VCC
2
× f
o) = sum of outputs.
[2]
The condition is VI = GND to VCC.
4.
Ordering information
Table 1:
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
tPHL, tPLH propagation delay
An to Bn; Bn to An
VCC = 2.5 V; CL =30pF
-
2.0
-
ns
VCC = 3.3 V; CL =50pF
-
1.9
-
ns
CI
input capacitance
-
4.0
-
pF
CI/O
input/output
capacitance
-
8.0
-
pF
CPD
power dissipation
capacitance per buffer
outputs enabled
[1] [2] -29
-
pF
outputs disabled
[1] [2] -5
-pF
Table 2:
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74ALVC16245DGG
−40 °C to +85 °C
TSSOP48
plastic thin shrink small outline package;
48 leads; body width 6.1 mm
SOT362-1
74ALVCH16245DGG
−40 °C to +85 °C
74ALVC16245DL
−40 °C to +85 °C
SSOP48
plastic shrink small outline package; 48 leads;
body width 7.5 mm
SOT370-1
74ALVCH16245DL
−40 °C to +85 °C


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