4

Figure 3. Block Diagram

Package

The overall package concept for these devices consists of

the following basic elements; two optical subassemblies,

a electrical subassembly and the housing as illustrated in

the block diagram in Figure 3.

The package outline drawing and pin out are shown in

Figures 4 and 5. The details of this package outline and pin

out are compliant with the multisource definition of the

2 x 10 DIP. The low profile of the Avago transceiver design

complies with the maximum height allowed for the LC

connector over the entire length of the package.

The electrical subassembly consists of a high volume mul-

tilayer printed circuit board on which the IC and various

surface-mounted passive circuit elements are attached.

The optical subassemblies are attached to the electrical

subassembly. These two units are then fitted within the

outer housing of the transceiver. The housing is then

encased with a metal EMI protective shield.

The electrical subassembly carries the signal pins that exit

from the bottom of the transceiver. The solder posts are

designed to provide the mechanical strength required to

withstand the loads imposed on the transceiver by mating

with the LC connectored fiber cables. Although they are

not connected electrically to the transceiver, it is recom-

mended to connect them to chassis ground.

DATA OUT

SIGNAL

DETECT

DATA IN

DATA IN

Tx DISABLE

QUANTIZER IC

LASER DRIVER

AND CONTROL

CIRCUIT

PIN PHOTODIODE

PREAMPLIFIER

SUBASSEMBLY

LASER

OPTICAL

SUBASSEMBLY

DATA OUT

LC

RECEPTACLE

R

T

R

T

LASER BIAS

MONITORING

LASER DIODE

MODULATOR

CASE

NOTE

NOTE: NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.