IEC 61000-4-2

The IEC 61000-4-2 standard covers ESD testing and

performance of finished equipment. The MAX3202E/

MAX3203E/MAX3204E/MAX3206E help users design

equipment that meets Level 4 of IEC 61000-4-2.

The main difference between tests done using the

Human Body Model and IEC 61000-4-2 is higher peak

current in IEC 61000-4-2. Because series resistance is

lower in the IEC 61000-4-2 ESD test model (Figure 6)

the ESD-withstand voltage measured to this standard is

generally lower than that measured using the Human

Body Model. Figure 3 shows the current waveform for

the ±8kV IEC 61000-4-2 Level 4 ESD Contact

Discharge test.

The Air-Gap Discharge test involves approaching the

device with a charged probe. The Contact Discharge

method connects the probe to the device before the

probe is energized.

Layout Recommendations

Proper circuit-board layout is critical to suppress ESD-

induced line transients. The MAX3202E/MAX3203E/

MAX3204E/MAX3206E clamp to 100V; however, with

improper layout, the voltage spike at the device is

much higher. A lead inductance of 10nH with a 45A

current spike at a dv/dt of 1ns results in an

ADDITION-

AL 450V spike on the protected line. It is essential that

the layout of the PC board follows these guidelines:

1) Minimize trace length between the connector or

input terminal, I/O_, and the protected signal line.

2) Use separate planes for power and ground to reduce

parasitic inductance and to reduce the impedance to

the power rails for shunted ESD current.

3) Ensure short ESD transient return paths to GND

4) Minimize conductive power and ground loops.

5) Do not place critical signals near the edge of the

PC board.

7) Bypass the supply of the protected device to GND

with a low-ESR ceramic capacitor as close to the

supply pin as possible.

UCSP Considerations

For general UCSP package information and PC layout

considerations, refer to Maxim Application Note 263,

Wafer-Level Chip-Scale Package.

___________________UCSP Reliability

The UCSP represents a unique packaging form factor

that may not perform equally to a packaged product

through traditional mechanical reliability tests. UCSP

reliability is integrally linked to the user’s assembly meth-

ods, circuit-board material, and usage environment.

The user should closely review these areas when con-

sidering use of a UCSP. Performance through operat-

ing life test and moisture resistance remains

uncompromised as it is primarily determined by the

wafer-fabrication process. Mechanical stress perfor-

mance is a greater consideration for a UCSP. UCSPs

are attached through direct solder contact to the user’s

PC board, foregoing the inherent stress relief of a pack-

aged product lead frame. Solder-joint contact integrity

must be considered. Table 1 shows the testing done to

characterize the UCSP reliability performance. In con-

clusion, the UCSP is capable of performing reliably

through environmental stresses as indicated by the

results in the table. Additional usage data and recom-

mendations are detailed in the UCSP application note,

which can be found on Maxim’s website at

www.maxim-ic.com.

Chip Information

DIODE COUNT:

MAX3202E: 4

MAX3203E: 6

MAX3204E: 8

MAX3206E: 12

PROCESS: BiCMOS

Low-Capacitance, 2/3/4/6-Channel, ±15kV ESD

Protection Arrays for High-Speed Data Interfaces

6

_______________________________________________________________________________________

CHARGE-CURRENT-

LIMIT RESISTOR

DISCHARGE

RESISTANCE

STORAGE

CAPACITOR

Cs

150pF

50Ω to 100Ω

330Ω

HIGH-

VOLTAGE

DC

SOURCE

DEVICE

UNDER

TEST

Figure 6. IEC 61000-4-2 ESD Test Model