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MAX3229 Datasheet(PDF) 11 Page - Maxim Integrated Products |
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MAX3229 Datasheet(HTML) 11 Page - Maxim Integrated Products |
11 / 14 page UCSP Reliability The UCSP represents a unique packaging form factor that may not perform equally to a packaged product through traditional mechanical reliability tests. CSP relia- bility is integrally linked to the user’s assembly methods, circuit board material, and usage environment. The user should closely review these areas when considering use of a CSP package. Performance through Operating Life Test and Moisture Resistance remains uncompromised as it is primarily determined by the wafer-fabrication process. Mechanical stress performance is a greater considera- tion for a CSP package. CSPs are attached through direct solder contact to the user’s PC board, foregoing the inherent stress relief of a packaged product lead frame. Solder joint contact integrity must be consid- ered. Table 5 shows the testing done to characterize the CSP reliability performance. In conclusion, the UCSP is capable of performing reliably through envi- ronmental stresses as indicated by the results in the table. Additional usage data and recommendations are detailed in the UCSP application note, which can be found on Maxim’s website at www.maxim-ic.com. Chip Information TRANSISTOR COUNT: 698 PROCESS TECHNOLOGY: CMOS +2.5V to +5.5V RS-232 Transceivers in UCSP ______________________________________________________________________________________ 11 VL MAX3229 5k Ω R1IN R1OUT TTL/CMOS C2- C2+ C1- C1+ A1 A5 C1 D1 A2 A3 A6 C6 B1 A4 E3 E5 E2 20 µA 20 µA E1 C5 B5 V- V+ VCC 2.5V TO 5.5V C4 0.1 µF C3 0.1 µF C1 0.1 µF CBYPASS C2 0.1 µF 0.1 µF 0.1 µF FORCEOFF FORCEON INVALID T1OUT T1IN GND VL TO POWER- MANAGEMENT UNIT RS-232 VL VL VL 1.65V TO 5.5V VL Typical Operating Circuits (continued) TEST CONDITIONS DURATION NO. OF FAILURES PER SAMPLE SIZE Temperature Cycle -35 °C to +85°C, -40 °C to +100°C 150 cycles, 900 cycles 0/10, 0/200 Operating Life TA = +70 °C 240hr 0/10 Moisture Resistance +20 °C to +60°C, 90% RH 240hr 0/10 Low-Temperature Storage -20 °C 240hr 0/10 Low-Temperature Operational -10 °C 24hr 0/10 Solderability 8hr steam age — 0/15 ESD ±2000V, Human Body Model — 0/5 High-Temperature Operating Life TJ = +150°C 168hr 0/45 Table 5. Reliability Test Data |
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