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MAX3384EEAP Datasheet(PDF) 6 Page - Maxim Integrated Products |
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MAX3384EEAP Datasheet(HTML) 6 Page - Maxim Integrated Products |
6 / 11 page pumps are shut off, V+ is pulled down to VCC, V- is pulled to ground, and the transmitter and receiver out- puts are disabled (high impedance). The time required to exit shutdown is typically 100µs, as shown in Figure 2. Connect SHDN to VCC if the shutdown mode is not used. ±15kV ESD Protection As with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electro- static discharges encountered during handling and assembly. The driver outputs and receiver inputs of the MAX3384E have extra protection against static electric- ity. Maxim’s engineers have developed state-of-the-art structures to protect these pins against ESD of ±15kV without damage. The ESD structures withstand high ESD in all states: normal operation, shutdown, and powered down. After an ESD event, Maxim’s “E” ver- sions keep working without latchup, whereas compet- ing RS-232 products can latch and must be powered down to remove latchup. ESD protection can be tested in various ways; the transmitter outputs and receiver inputs of this product family are characterized for protection to the following limits: 1) ±15kV using the Human Body Model 2) ±8kV using the contact-discharge method specified in IEC 1000-4-2 3) ±15kV using IEC 1000-4-2’s air-gap method. ESD Test Conditions ESD performance depends on a variety of conditions. Contact Maxim for a reliability report that documents test setup, test methodology, and test results. Human Body Model Figure 3a shows the Human Body Model, and Figure 3b shows the current waveform it generates when dis- charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest, which is then discharged into the test device through a 1.5k Ω resistor. IEC 1000-4-2 The IEC 1000-4-2 standard covers ESD testing and per- formance of finished equipment; it does not specifically refer to integrated circuits. The MAX3384E helps you design equipment that meets Level 4 (the highest level) of IEC 1000-4-2, without the need for additional ESD-pro- tection components. The major difference between tests done using the Human Body Model and IEC 1000-4-2 is higher peak current in IEC 1000-4-2, because series resistance is lower in the IEC 1000-4-2 model. Hence, the ESD with- stand voltage measured to IEC 1000-4-2 is generally lower than that measured using the Human Body Model. Figure 4a shows the IEC 1000-4-2 model, and Figure 4b shows the current waveform for the ±8kV IEC 1000-4-2 Level 4 ESD contact-discharge test. The air-gap test involves approaching the device with a charged probe. The contact-discharge method con- nects the probe to the device before the probe is ener- gized. Machine Model The Machine Model for ESD tests all pins using a 200pF storage capacitor and zero discharge resis- tance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. Of course, all pins require this protec- tion during manufacturing, not just RS-232 inputs and outputs. Therefore, after PC board assembly, the Machine Model is less relevant to I/O ports. Applications Information Capacitor Selection The capacitor type used for C1–C4 is not critical for proper operation; polarized or nonpolarized capacitors ±15kV ESD-Protected, 3.0V to 5.5V, Low-Power, up to 250kbps, True RS-232 Transceiver 40 µs/div SHDN T2OUT T1OUT 5V/div 0 2V/div 0 VCC = 3.3V C1–C4 = 0.1 µF Figure 2. Transmitter Outputs Exiting Shutdown or Powering Up 0.1 0.047 C1, CBYPASS (µF) 0.1 0.1 0.33 C2, C3, C4 (µF) 0.47 3.0 to 3.6 4.5 to 5.5 VCC (V) 3.0 to 5.5 Table 2. Required Minimum Capacitance Values 6 _______________________________________________________________________________________ |
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