MAX4410 datasheet(2/20 Pages) MAXIM

Part #	MAX4410

Description	80mW, DirectDrive Stereo Headphone Driver with Shutdown

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Manufacturer	MAXIM [Maxim Integrated Products]

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80mW, DirectDrive Stereo Headphone Driver

with Shutdown

2

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

(PVDD = SVDD = 3V, PGND = SGND = 0, SHDNL = SHDNR = SVDD, C1 = C2 = 2.2µF, RIN = RF = 10k

Ω, RL = ∞, TA = TMIN to TMAX,

unless otherwise noted. Typical values are at TA = +25°C.) (Note 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

PGND to SGND .....................................................-0.3V to +0.3V

PVDD to SVDD .................................................................-0.3V to +0.3V

PVSS to SVSS .........................................................-0.3V to +0.3V

PVDD and SVDD to PGND or SGND .........................-0.3V to +4V

PVSS and SVSS to PGND or SGND ..........................-4V to +0.3V

IN_ to SGND ..........................................................-0.3V to +0.3V

SHDN_ to SGND........................(SGND - 0.3V) to (SVDD + 0.3V)

OUT_ to SGND ............................(SVSS - 0.3V) to (SVDD + 0.3V)

C1P to PGND.............................(PGND - 0.3V) to (PVDD + 0.3V)

C1N to PGND .............................(PVSS - 0.3V) to (PGND + 0.3V)

Output Short Circuit to GND or VDD...........................Continuous

Continuous Power Dissipation (TA = +70°C)

14-Pin TSSOP (derate 9.1mW/°C above +70°C) ..........727mW

16-Bump UCSP (derate 15.2mW/°C above +70°C)....1212mW

Junction Temperature ......................................................+150°C

Operating Temperature Range ...........................-40°C to +85°C

Storage Temperature Range .............................-65°C to +150°C

Bump Temperature (soldering) (Note 1)

Infrared (15s) ...............................................................+220°C

Vapor Phase (60s) .......................................................+215°C

Lead Temperature (soldering, 10s) .................................+300°C

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage Range

VDD

Guaranteed by PSRR test

1.8

3.6

V

One channel enabled

4

Quiescent Supply Current

IDD

Two channels enabled

7

11.5

mA

Shutdown Supply Current

ISHDN

SHDNL = SHDNR = GND

6

10

µA

VIH

0.7 x

SVDD

SHDN_ Thresholds

VIL

0.3 x

SVDD

V

SHDN_ Input Leakage Current

-1

+1

µA

SHDN_ to Full Operation

tSON

175

µs

CHARGE PUMP

Oscillator Frequency

fOSC

272

320

368

kHz

AMPLIFIERS

Input Offset Voltage

VOS

Input AC-coupled, RL = 32

Ω

0.5

2.4

mV

Input Bias Current

IBIAS

-100

+100

nA

1.8V

≤ VDD ≤ 3.6V

DC

75

90

fRIPPLE = 1kHz

90

Power-Supply Rejection Ratio

PSRR

200mVP-P ripple

fRIPPLE = 20kHz

55

dB

RL = 32

Ω

65

Output Power

POUT

THD + N = 1%

RL = 16

Ω

40

80

mW

Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device

can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-

mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.

Preheating is required. Hand or wave soldering is not allowed.

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