PMEG2010AEH_PMEG2010AET_3

© NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 03 — 28 March 2007

6 of 11

NXP Semiconductors

PMEG2010AEH; PMEG2010AET

8.

Test information

9.

Package outline

10. Packing information

[1]

For further information and the availability of packing methods, see Section 14.

Fig 4.

Duty cycle definition

P

t

006aaa812

duty cycle

δ =

Fig 5.

Package outline SOD123F

Fig 6.

Package outline SOT23 (TO-236AB)

04-11-29

Dimensions in mm

1.2

1.0

0.25

0.10

3.6

3.4

2.7

2.5

0.55

0.35

0.70

0.55

1.7

1.5

1

2

04-11-04

Dimensions in mm

0.45

0.15

1.9

1.1

0.9

3.0

2.8

2.5

2.1

1.4

1.2

0.48

0.38

0.15

0.09

12

3

Table 9.

Packing methods

The indicated -xxx are the last three digits of the 12NC ordering code.[1]

Type number

Package

Description

Packing quantity

3000

10000

PMEG2010AEH

SOD123F

4 mm pitch, 8 mm tape and reel

-115

-135

PMEG2010AET

SOT23

4 mm pitch, 8 mm tape and reel

-215

-235