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LP2950-50 Datasheet(PDF) 4 Page - Texas Instruments

Part # LP2950-50
Description  Adjustable Micropower Voltage Regulators with Shutdown
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

LP2950-50 Datasheet(HTML) 4 Page - Texas Instruments

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LP2950, LP2951
SLVS582I – APRIL 2006 – REVISED NOVEMBER 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VIN
Continuous input voltage range
–0.3
30
V
VSHDN
SHUTDOWN input voltage range
–1.5
30
V
VERROR
ERROR comparator output voltage range(2)
–1.5
30
V
VFDBK
FEEDBACK input voltage range (2) (3)
–1.5
30
V
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
May exceed input supply voltage
(3)
If load is returned to a negative power supply, the output must be diode clamped to GND.
6.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
–65
150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
0
2500
pins(1)
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification
0
1000
JESD22-C101, all pins(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
MAX
UNIT
VIN
Supply input voltage
See (1)
30
V
TJ
Operating virtual junction temperature
–40
125
°C
(1)
Minimum VIN is the greater of:
(a) 2 V (25°C), 2.3 V (over temperature), or
(b) VOUT(MAX) + Dropout (Max) at rated IL
6.4 Thermal Information
LP2950
LP2951
THERMAL METRIC(1)
LP
D
P
DRG
UNIT
3 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
140
97
84.6
52.44
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
4
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Copyright © 2006–2014, Texas Instruments Incorporated
Product Folder Links: LP2950 LP2951


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