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PMEG3010AESB Datasheet(PDF) 3 Page - NXP Semiconductors

Part # PMEG3010AESB
Description  30 V, 1 A low VF MEGA Schottky barrier rectifier
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PMEG3010AESB Datasheet(HTML) 3 Page - NXP Semiconductors

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NXP Semiconductors
PMEG3010AESB
30 V, 1 A low VF MEGA Schottky barrier rectifier
PMEG3010AESB
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet
18 June 2015
3 / 14
7. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VR
reverse voltage
Tj = 25 °C
-
30
V
IF
forward current
Tsp ≤ 140 °C; δ = 1
-
1.4
A
δ = 0.5 ; f = 20 kHz; Tamb ≤ 115 °C;
square wave
[1]
-
1
A
IF(AV)
average forward current
δ = 0.5 ; f = 20 kHz; Tsp ≤ 145 °C;
square wave
-
1
A
IFRM
repetitive peak forward current tp ≤ 1 ms; δ ≤ 0.25
-
4
A
IFSM
non-repetitive peak forward
current
tp = 8 ms; Tj(init) = 25 °C; square wave
-
10
A
[2]
-
0.525 W
[3]
-
1
W
Ptot
total power dissipation
Tamb ≤ 25 °C
[1]
-
1.78
W
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
-55
150
°C
Tstg
storage temperature
-65
150
°C
[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for anode and cathode
1 cm2 each.
8. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[1][2]
-
-
240
K/W
[1][3]
-
-
125
K/W
Rth(j-a)
thermal resistance
from junction to
ambient
in free air
[1][4]
-
-
70
K/W
Rth(j-sp)
thermal resistance
from junction to solder
point
[5]
-
-
15
K/W
[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for anode and cathode
1 cm2 each.
[4] Device mounted on a ceramic PCB, Al2O3, standard footprint.
[5] Soldering point of anode tab.


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