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PMEG3010AESB Datasheet(PDF) 3 Page - NXP Semiconductors |
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PMEG3010AESB Datasheet(HTML) 3 Page - NXP Semiconductors |
3 / 14 page NXP Semiconductors PMEG3010AESB 30 V, 1 A low VF MEGA Schottky barrier rectifier PMEG3010AESB All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved Product data sheet 18 June 2015 3 / 14 7. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VR reverse voltage Tj = 25 °C - 30 V IF forward current Tsp ≤ 140 °C; δ = 1 - 1.4 A δ = 0.5 ; f = 20 kHz; Tamb ≤ 115 °C; square wave [1] - 1 A IF(AV) average forward current δ = 0.5 ; f = 20 kHz; Tsp ≤ 145 °C; square wave - 1 A IFRM repetitive peak forward current tp ≤ 1 ms; δ ≤ 0.25 - 4 A IFSM non-repetitive peak forward current tp = 8 ms; Tj(init) = 25 °C; square wave - 10 A [2] - 0.525 W [3] - 1 W Ptot total power dissipation Tamb ≤ 25 °C [1] - 1.78 W Tj junction temperature - 150 °C Tamb ambient temperature -55 150 °C Tstg storage temperature -65 150 °C [1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for anode and cathode 1 cm2 each. 8. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit [1][2] - - 240 K/W [1][3] - - 125 K/W Rth(j-a) thermal resistance from junction to ambient in free air [1][4] - - 70 K/W Rth(j-sp) thermal resistance from junction to solder point [5] - - 15 K/W [1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for anode and cathode 1 cm2 each. [4] Device mounted on a ceramic PCB, Al2O3, standard footprint. [5] Soldering point of anode tab. |
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