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BLM8G0710S-45AB Datasheet(PDF) 3 Page - NXP Semiconductors

Part # BLM8G0710S-45AB
Description  LDMOS 2-stage power MMIC
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

BLM8G0710S-45AB Datasheet(HTML) 3 Page - NXP Semiconductors

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BLM8G0710S-45AB_S-45ABG
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved.
Objective data sheet
Rev. 1 — 20 August 2015
3 of 20
NXP Semiconductors
BLM8G0710S-45AB(G)
LDMOS 2-stage power MMIC
3.
Ordering information
4.
Block diagram
5.
Limiting values
[1]
Continuous use at maximum temperature will affect the reliability. For details refer to the online MTF calculator.
RF_OUT_B/VDS(B2)
15
RF output peaking section (B) / drain-source voltage of peaking section, final stage (B2)
RF_OUT_A/VDS(A2)
16
RF output carrier section (A) / drain-source voltage of carrier section, final stage (A2)
GND
flange RF ground
Table 2.
Pin description …continued
Symbol
Pin
Description
Table 3.
Ordering information
Type number
Package
Name
Description
Version
BLM8G0710S-45AB
HSOP16F
plastic, heatsink small outline package; 16 leads(flat)
SOT1211-2
BLM8G0710S-45ABG
HSOP16
plastic, heatsink small outline package; 16 leads
SOT1212-2
Fig 2.
Block diagram
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage
-
65
V
VGS
gate-source voltage
0.5
+13
V
Tstg
storage temperature
65
+150
C
Tj
junction temperature
[1] -
225
C
Tcase
case temperature
-
150
C


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