UCC27518A-Q1, UCC27519A-Q1

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SLVSC90B – AUGUST 2013 – REVISED AUGUST 2015

8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

Supply voltage

VDD

–0.3

20

V

DC

–0.3

VDD + 0.3

OUTA, OUTB voltage

V

–2

VDD + 0.3

Output continuous current

0.3

A

Output pulsed current (0.5 µs)

4

A

–6

20

V

–40

150

°C

Soldering, 10 s

300

Lead temperature

°C

Reflow

260

–65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to GND unless otherwise noted. Currents are positive into, negative out of the specified terminal. See

Packaging Section of the datasheet for thermal limitations and considerations of packages.

(3)

These devices are sensitive to electrostatic discharge; follow proper device handling procedures.

(4)

Values are verified by characterization on bench

(5)

Maximum voltage on input pins is not restricted by the voltage on the VDD pin.

8.2 ESD Ratings

VALUE

UNIT

±2500

Electrostatic discharge

V

Charged-device model (CDM), per AEC Q100-011

±1500

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

8.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage, VDD

4.5

12

18

V

Input voltage, (IN+ and IN–) and enable (EN)

0

18

V

Operating ambient temperature

–40

140

°C

8.4 Thermal Information

UCC27518A-Q1

UCC27519A-Q1

UNIT

DBV (SOT-23)

5 PINS

Junction-to-ambient thermal resistance

215.5

°C/W

Junction-to-case (top) thermal resistance

136.1

°C/W

Junction-to-board thermal resistance

43.2

°C/W

Junction-to-top characterization parameter

20.3

°C/W

Junction-to-board characterization parameter

42.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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