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CSD87334Q3D Datasheet(PDF) 3 Page - Texas Instruments |
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CSD87334Q3D Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 22 page  CSD87334Q3D www.ti.com SLPS546 – JULY 2015 5 Specifications 5.1 Absolute Maximum Ratings TA = 25°C (unless otherwise noted) (see (1)) MIN MAX UNIT VIN to PGND 30 V VSW to PGND 30 V Voltage VSW to PGND (10 ns) 32 V TG to TGR –8 10 V BG to PGND –8 10 V IDM Pulsed current rating 60 A PD Power dissipation 6 W Sync FET, ID = 31 A, L = 0.1 mH 48 EAS Avalanche energy mJ Control FET, ID = 31 A, L = 0.1 mH 48 TJ Operating junction temperature –55 150 °C Tstg Storage temperature –55 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability 5.2 Recommended Operating Conditions TA = 25° (unless otherwise noted) MIN MAX UNIT VGS Gate drive voltage 3.3 8 V VIN Input supply voltage 24 V ƒSW Switching frequency CBST = 0.1 µF (min) 1500 kHz Operating current 20 A TJ Operating temperature 125 °C 5.3 Power Block Performance TA = 25° (unless otherwise noted) (see (1)) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VIN = 12 V, VGS = 5 V, VOUT = 3.3 V, PLOSS Power loss(1) IOUT = 12 A, ƒSW = 500 kHz, 1.6 W LOUT = 1 µH, TJ = 25ºC IQVIN VIN quiescent current TG to TGR = 0 V BG to PGND = 0 V 10 µA (1) Measurement made with six 10-µF (TDK C3216X5R1C106KT or equivalent) ceramic capacitors placed across VIN to PGND pins and using a high current 5-V driver IC. 5.4 Thermal Information TA = 25°C (unless otherwise stated) THERMAL METRIC MIN TYP MAX UNIT Junction-to-ambient thermal resistance (min Cu)(1) 130 RθJA °C/W Junction-to-ambient thermal resistance (max Cu)(1)(2) 75 Junction-to-case thermal resistance (top of package)(1) 21 RθJC °C/W Junction-to-case thermal resistance (PGND pin) (1) 2.1 (1) RθJC is determined with the device mounted on a 1-inch 2 (6.45 cm2), 2-oz. (0.071 mm thick) Cu pad on a 1.5 inch × 1.5 inch (3.81 cm × 3.81 cm), 0.06-inch (1.52 mm) thick FR4 board. RθJC is specified by design while RθJA is determined by the user’s board design. (2) Device mounted on FR4 material with 1-inch2 (6.45 cm2) Cu. Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: CSD87334Q3D |
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