DRV2700

SLOS861B – MARCH 2015 – REVISED APRIL 2015

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7 Specifications

7.1 Absolute Maximum Ratings

(1)

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

–0.3

6

V

Input voltage

IN+, IN–, EN, GAIN0, GAIN1, FB

–0.3

V

Boost/Output Voltage

120

V

Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds

260

°C

–40

85

°C

–40

150

°C

–65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins

±2500

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

±1500

all pins

7.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Supply voltage

3

5.5

V

Boost voltage

BST

15

105

V

Differential input voltage

IN+, IN–

V

Digital input low voltage

0.75

V

Digital input high voltage

1.4

V

Current-limit control resistor

6

35

k

Ω

L

Inductance for boost converter

3.3

µH

(1)

Gains are optimized for a 1.8-V peak input

7.4 Thermal Information

RGP (VQFN)

UNIT

20 PINS

Junction-to-ambient thermal resistance

33.1

Junction-to-case (top) thermal resistance

30.9

Junction-to-board thermal resistance

8.7

°C/W

Junction-to-top characterization parameter

0.4

Junction-to-board characterization parameter

8.7

Junction-to-case (bottom) thermal resistance

2.5

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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