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PMEG6020ELR Datasheet(PDF) 3 Page - NXP Semiconductors

Part # PMEG6020ELR
Description  60 V, 2 A low leakage current Schottky barrier rectifier
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PMEG6020ELR Datasheet(HTML) 3 Page - NXP Semiconductors

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NXP Semiconductors
PMEG6020ELR
60 V, 2 A low leakage current Schottky barrier rectifier
PMEG6020ELR
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2014. All rights reserved
Product data sheet
3 June 2014
3 / 15
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VR
reverse voltage
Tj = 25 °C
-
60
V
IF
forward current
Tsp = 155 °C; δ = 1
-
2.83
A
δ = 0.5; f = 20 kHz; Tamb ≤ 90 °C;
square wave
[1]
-
2
A
IF(AV)
average forward current
δ = 0.5; f = 20 kHz; Tsp ≤ 160 °C;
square wave
-
2
A
IFSM
non-repetitive peak forward
current
tp = 8 ms; Tj(init) = 25 °C; square wave
-
50
A
[2]
-
680
mW
[3]
-
1150
mW
Ptot
total power dissipation
Tamb ≤ 25 °C
[1]
-
2140
mW
Tj
junction temperature
-
175
°C
Tamb
ambient temperature
-55
175
°C
Tstg
storage temperature
-65
175
°C
[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
9. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
[1][2]
-
-
220
K/W
[1][3]
-
-
130
K/W
Rth(j-a)
thermal resistance
from junction to
ambient
in free air
[1][4]
-
-
70
K/W
Rth(j-sp)
thermal resistance
from junction to solder
point
[5]
-
-
18
K/W
[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4] Device mounted on a ceramic PCB, Al2O3, standard footprint.
[5] Soldering point of cathode tab.


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