PMEG10030ELP_15 datasheet(3/15 Pages) PHILIPS

Part #	PMEG10030ELP

Description	100 V, 3 A low leakage current Schottky barrier rectifier

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NXP Semiconductors

PMEG10030ELP

100 V, 3 A low leakage current Schottky barrier rectifier

PMEG10030ELP

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Product data sheet

7 May 2015

3 / 15

8. Limiting values

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

VR

reverse voltage

Tj = 25 °C

-

100

V

IF

forward current

Tsp = 155 °C; δ = 1

-

4.2

A

δ = 0.5; f = 20 kHz; Tamb ≤ 55 °C;

square wave

[1]

-

3

A

IF(AV)

average forward current

δ = 0.5; f = 20 kHz; Tsp ≤ 160 °C;

square wave

-

3

A

IFSM

non-repetitive peak forward

current

tp = 8 ms; Tj(init) = 25 °C; square wave

-

70

A

[2]

-

750

mW

[3]

-

1250

mW

Ptot

total power dissipation

Tamb ≤ 25 °C

[1]

-

2500

mW

Tj

junction temperature

-

175

°C

Tamb

ambient temperature

-55

175

°C

Tstg

storage temperature

-65

175

°C

[1] Device mounted on a ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

9. Thermal characteristics

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

[1][2]

-

200

K/W

[1][3]

-

120

K/W

Rth(j-a)

thermal resistance

from junction to

ambient

in free air

[1][4]

-

60

K/W

Rth(j-sp)

thermal resistance

from junction to solder

point

[5]

-

12

K/W

[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse

power losses PR are a significant part of the total power losses.

[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

[4] Device mounted on a ceramic PCB, Al2O3, standard footprint.

[5] Soldering point of cathode tab.

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