Part No./型号

SMD SPECIFICATION

Page 9 of 11

Thermal design of the end applications are of paramount importance. Please consider the

heat generation of the LED when making the system design. It is necessary to avoid intense heat

generation and operate within the maximum ratings given in this specification.

应用产品的热学设计是至关重要的。在做系统设计时，请考虑LED的散热，避免热量

的积累，必须严格的在允许的温度范围内使用。

9.1.Soldering/ 焊接

9.2 Lead Solder/

回流焊接

9.3

Notes for reflow soldering/回流焊注意事项:

1. Baking process should be performed by using more than 24hours baking at 60±5℃

before using LEDs./ 在使用前LED必须在60±5℃中烘烤至少24小时。

2. Please choose the right nozzle to avoid the damage to products due to the pressure./请

选择合适的吸嘴大小和压力，以避免对产品产生不良隐患。

3. No more than twice for reflow soldering./回流焊不可超过两次。

9.4 Hand Soldering

（Not Recommended）/手工焊接（不推荐）

Soldering iron/烙铁焊接：260 degrees C max/不超过260℃；3 seconds max/不超过3s；

once/允许1次.

9.5 Cleaning/ 清洗

:PLCC3014-W3-U

Hebei I.T. (Shanghai) Co., Ltd