CHA4102-QEG

S band Digital VGA

Ref. : DSCHA4102-QEG2335 - 30 Nov 12

6/16

Specifications subject to change without notice

Bât. Charmille - Parc SILIC - 10, Avenue du Québec - 91140 VILLEBON-SUR-YVETTE - France

Tel.: +33 (0) 1 69 86 32 00 - Fax: +33 (0) 1 69 86 34 34

Device thermal performances

All the figures given in this section are obtained assuming that the QFN device is cooled

down only by conduction through the package thermal pad (no convection mode

considered).

The temperature is monitored at the package back-side interface (Tcase) as shown below.

The system maximum temperature must be adjusted in order to guarantee that Tcase

remains below the maximum value specified in the next table. So, the PCB system must be

designed to comply with this requirement.

A derating must be applied on the dissipated power if the Tcase temperature can not be

maintained below the maximum temperature specified (see the curve Pdiss. Max) in order to

guarantee the nominal device life time (MTTF).