TPS55330

SLVSBX8A – MAY 2013 – REVISED DECEMBER 2014

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6 Specifications

6.1 Absolute Maximum Ratings

(1)

over operating temperature range (unless otherwise noted)

MIN

MAX

UNIT

–0.3

18

V

–0.3

18

V

–0.3

3

V

–0.3

5

V

–0.3

7

V

–0.3

24

V

Operating junction temperature range

–40

150

°C

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground pin

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

Input voltage range

2.9

16

V

Output voltage range

22

V

EN voltage range

0

16

V

External switching frequency logic input range

0

5

V

Operating free-air temperature

–40

125

°C

Operating junction temperature

–40

150

°C

6.4 Thermal Information

TPS55330

QFN

UNIT

16 PINS

Junction-to-ambient thermal resistance

43.3

Junction-to-case (top) thermal resistance

38.7

Junction-to-board thermal resistance

14.5

°C/W

Junction-to-top characterization parameter

0.4

Junction-to-board characterization parameter

14.5

Junction-to-case (bottom) thermal resistance

3.5

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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