10

FN9072.8

May 1, 2012

HIP6601B, HIP6603B, HIP6604B

Small Outline Exposed Pad Plastic Packages (EPSOIC)

INDEX

AREA

E

D

N

12

3

-B-

0.25(0.010)

C A

M

BS

e

-A-

L

B

M

-C-

A1

A

SEATING PLANE

0.10(0.004)

C

H

0.25(0.010)

B

M

M

α

P1

12

3

P

BOTTOM VIEW

N

TOP VIEW

SIDE VIEW

M8.15B

8 LEAD NARROW BODY SMALL OUTLINE EXPOSED PAD

PLASTIC PACKAGE

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

0.056

0.066

1.43

1.68

-

A1

0.001

0.005

0.03

0.13

-

B

0.0138

0.0192

0.35

0.49

9

C

0.0075

0.0098

0.19

0.25

-

D

0.189

0.196

4.80

4.98

3

E

0.150

0.157

3.81

3.99

4

e

0.050 BSC

1.27 BSC

-

H

0.230

0.244

5.84

6.20

-

h

0.010

0.016

0.25

0.41

5

L

0.016

0.035

0.41

0.89

6

N8

8

7

α

0°

8°

0°

8°

-

P

-

0.094

-

2.387

11

P1

-

0.094

-

2.387

11

Rev. 5 8/10

NOTES:

1. Symbols are defined in the “MO Series Symbol List” in Section

2.2 of Publication Number 95.

2. Dimensioning and tolerancing per ANSI Y14.5M-1982.

3. Dimension “D” does not include mold flash, protrusions or gate

burrs. Mold flash, protrusion and gate burrs shall not exceed

0.15mm (0.006 inch) per side.

4. Dimension “E” does not include interlead flash or protrusions.

Interlead flash and protrusions shall not exceed 0.25mm (0.010

inch) per side.

5. The chamfer on the body is optional. If it is not present, a visual

index feature must be located within the crosshatched area.

6. “L” is the length of terminal for soldering to a substrate.

7. “N” is the number of terminal positions.

8. Terminal numbers are shown for reference only.

9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater

above the seating plane, shall not exceed a maximum value of

0.61mm (0.024 inch).

10. Controlling dimension: INCH. Converted millimeter dimensions

are not necessarily exact.

11. Dimensions “P” and “P1” are thermal and/or electrical enhanced

variations. Values shown are maximum size of exposed pad

within lead count and body size.