2

FN9221.2

April 27, 2009

Pinouts

Ordering Information

PART NUMBER

(Note)

PART

MARKING

TEMP. RANGE

(°C)

PACKAGE

(Pb-Free)

PKG.

DWG. #

ISL6609CBZ

ISL66 09CBZ

0 to +70

8 Ld SOIC

M8.15

ISL6609CBZ-T*

ISL66 09CBZ

0 to +70

8 Ld SOIC

M8.15

ISL6609CRZ

609Z

0 to +70

8 Ld 3x3 QFN

L8.3x3

ISL6609CRZ-T*

609Z

0 to +70

8 Ld 3x3 QFN

L8.3x3

ISL6609IBZ

ISL66 09IBZ

-40 to +85

8 Ld SOIC

M8.15

ISL6609IBZ-T*

ISL66 09IBZ

-40 to +85

8 Ld SOIC

M8.15

ISL6609IRZ

09IZ

-40 to +85

8 Ld 3x3 QFN

L8.3x3

ISL6609IRZ-T*

09IZ

-40 to +85

8 Ld 3x3 QFN

L8.3x3

ISL6609ACBZ

6609 ACBZ

0 to +70

8 Ld SOIC

M8.15

ISL6609ACBZ-T*

6609 ACBZ

0 to +70

8 Ld SOIC

M8.15

ISL6609ACRZ

09AZ

0 to +70

8 Ld 3x3 QFN

L8.3x3

ISL6609ACRZ-T*

09AZ

0 to +70

8 Ld 3x3 QFN

L8.3x3

ISL6609AIBZ

6609 AIBZ

-40 to +85

8 Ld SOIC

M8.15

ISL6609AIBZ-T*

6609 AIBZ

-40 to +85

8 Ld SOIC

M8.15

ISL6609AIRZ

9AIZ

-40 to +85

8 Ld 3x3 QFN

L8.3x3

ISL6609AIRZ-T*

9AIZ

-40 to +85

8 Ld 3x3 QFN

L8.3x3

ISL6609AIRZ-TK*

9AIZ

-40 to +85

8 Ld 3x3 QFN

L8.3x3

*Please refer to TB347 for details on reel specifications.

NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%

matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations).

Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J

STD-020.

ISL6609, ISL6609A

(8 LD SOIC)

TOP VIEW

ISL6609, ISL6609A

(8 LD QFN)

TOP VIEW

UGATE

BOOT

PWM

GND

1

2

3

4

8

7

6

5

PHASE

EN

VCC

LGATE

7

8

4

3

1

2

6 EN

VCC

BOOT

PWM

5

6

ISL6609, ISL6609A