NX3008PBKMB

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Product data sheet

Rev. 1 — 11 May 2012

4 of 15

NXP Semiconductors

NX3008PBKMB

30 V, single P-channel Trench MOSFET

6.

Thermal characteristics

[1]

Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2]

Fig 4.

Safe operating area; junction to ambient; continuous and peak drain currents as a function of drain-source

voltage

aaa-002632

-10

(A)

-10

-1

-1

(1)

(4)

(5)

(3)

(2)

Table 6.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance

from junction to

ambient

in free air

[1]

-

305

360

K/W

[2]

-

150

175

K/W

thermal resistance

from junction to solder

point

--40

K/W