NX3DV42_15 datasheet(4/19 Pages) PHILIPS

Part #	NX3DV42

Description	Dual high-speed USB 2.0 double-pole double-throw analog switch

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Manufacturer	PHILIPS [NXP Semiconductors]

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NX3DV42

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Product data sheet

Rev. 3 — 13 February 2013

4 of 19

NXP Semiconductors

NX3DV42

Dual high-speed USB 2.0 double-pole double-throw analog switch

9.

Limiting values

[1]

The minimum input voltage rating may be exceeded if the input current rating is observed.

[2]

For XQFN10 packages: above 100

C derate linearly with 4 mW/K.

10. Recommended operating conditions

[1]

To avoid sinking GND current from terminals D+ and D

 when switch current flows in terminals HSDn+ and HSDn, the voltage drop

across the bidirectional switch must not exceed 0.4 V. If the switch current flows into terminals D+ and D

, no GND current will flow from

terminals HSDn+ and HSDn

. In this case, there is no limit for the voltage drop across the switch.

11. Static characteristics

Table 5.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).

Symbol

Parameter

Conditions

Min

Max

Unit

VCC

supply voltage

0.5

+5.5

V

VI

input voltage

pins S and OE

[1]

0.5

+5.5

V

VSW

switch voltage

0.5

+5.5

V

IIK

input clamping current

VI < 0.5 V

50

-

mA

ISK

switch clamping current

VI < 0.5 V

50

-

mA

ISW

switch current

-

100

mA

ICC

supply current

-

+50

mA

Tstg

storage temperature

65

+150

C

Ptot

total power dissipation

Tamb = 40 Cto +125 C

[2] -250

mW

Table 6.

Recommended operating conditions

Symbol Parameter

Conditions

Min

Max

Unit

VCC

supply voltage

3.0

4.3

V

VI

input voltage

pins S and OE

04.5

V

VSW

switch voltage

[1] 0VCC

V

Tamb

ambient temperature

40

+125

C

Table 7.

Static characteristics

At recommended operating conditions; voltages are referenced to GND (ground 0 V).

Symbol Parameter

Conditions

Tamb = 40 C to +85 C

Tamb = 40 C to +125 C Unit

Min

Typ[1]

Max

Min

Max

VIH

HIGH-level

input voltage

VCC = 3.0 V to 3.6 V

1.3

-

1.3

-

V

VCC =4.3 V

1.7

-

1.7

-

V

VIL

LOW-level

input voltage

VCC = 3.0 V to 3.6 V

-

0.5

-

0.5

V

VCC = 4.3 V

-

0.7

-

0.7

V

VIK

input clamping

voltage

VCC =3.0 V; II = 18 mA

-

1.2

-

1.2

V

II

input leakage

current

pins S and OE;

VI = GND to 4.3 V; VCC =4.3 V;

see Figure 5

--

1-

10

A

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