PSMN3R9-25MLC

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Product data sheet

Rev. 4 — 15 June 2012

4 of 14

NXP Semiconductors

PSMN3R9-25MLC

N-channel 25 V 4.15 m

Ω logic level MOSFET in LFPAK33 using NextPower Technology

5.

Thermal characteristics

Fig 4.

Safe operating area; continuous and peak drain currents as a function of drain-source voltage

003aaj779

10

-1

1

10

10

2

10

3

10

-1

1

10

10

2

V

I

D

(A)

DC

100

μs

10 ms

μs

100 ms

1 ms

Table 5.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from

junction to mounting base

see Figure 5

-

1.95

2.18

K/W

Fig 5.

Transient thermal impedance from junction to mounting base as a function of pulse duration

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single shot

0.2

0.1

0.05

10

-2

10

-1

1

10

10

-5

10

-4

10

-3

10

-2

10

-1

1

t

Z

th(j-mb)

(K/W)

δ= 0.5

0.02

T

P

t

T

δ =

10

-6