PAGE . 1

March 2,2015-REV.02

PJ2301

FEATURES

• R

• R

• Advanced Trench Process Technology

• High Density Cell Design For Ultra Low On-Resistance

• Specially Designed for DC/DC converters

• Low gate charge

• Lead free in compliance with EU RoHS 2011/65/EU directive

• Green molding compound as per IEC61249 Std. . (Halogen Free)

MECHANICAL DATA

• Case : SOT-23 Package

• Terminals : Solderable per MIL-STD-750,Method 2026

• Approx. Weight: 0.0003 ounces, 0.0084 grams

• Marking : 01

20V P-Channel Enhancement Mode MOSFET

Maximum Ratings and Thermal Characteristics (T

NOTES:

1. Mounted on minimum pad layout.

2. Mounted on 48cm

.

PA RA ME TE R

S ym b o l

L i mi t

Uni ts

D r ai n- S o ur c e Vo ltage

V

DS

-2 0

V

G a t e - S our c e Vo ltage

V

GS

+ 8V

C o nt i nuo us D r ai n C ur r ent ( Not es 1)

S t eady- S ta t e

S t eady- S ta t e

t < 5s

T

T

T

I

D

-1 .7 5

-1 . 4

-2

A

P uls ed D r ai n C ur r ent ( Not es 1)

I

DM

10

A

P o we r D i s s i pat i on ( Notes 2)

T

T

P

D

700

450

mW

Typi cal Ther m a l Re s i s t anc e ( Not es 1)

R

θJA

175

Typi cal Ther m a l Re s i s t anc e ( Not es 1)

R

θJL

65

O per at i ng Junc t i on and S t or age Te m p er at ur e Ra ng e

T

- 55 t o + 150

0.120(3.04)

0.110(2.80)

0.056(1.40)

0.047(1.20)

0.079(2.00)

0.070(1.80)

0.020(0.50)

0.013(0.35)

0.044(1.10)

0.035(0.90)

0.008(0.20)

0.003(0.08)

0.004(0.10)

0.000(0.00)